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电子包装中低温多元件的应用和最近的进展:一篇评论

Guodong Wu^1,2, Jingfang Shen³, Ding Zhou¹

¹Department of Mechanical Engineering, Faculty of Engineering, University of Malaya, Kuala Lumpur 50603, Malaysia.

|March 27, 2025

概括

低温多元件合剂可以保护灵活电子产品中的热敏基板. 这些先进的将3D包装过程中的热损伤降到最低,防止芯片故障,并使可靠的设备制造成为可能.

科学领域:

材料科学材料科学材料科学
电子工程电子工程
纳米技术纳米技术

背景情况:

灵活的可穿戴设备和太阳能单元使用热敏的有机基板.
这些基板在3D包装的粘合过程中存在热损伤的风险,导致芯片变形或故障.

研究的目的:

审查用于先进电子包装的低温多元件接器.
分析它们的湿透性,制备和金属元素的影响.
讨论接口反应和接关节的机械特性.

主要方法:

关于多元组件接研究的文献综述.
湿度和制备技术的分析.
检查界面反应和机械性能.

主要成果:

多元件提供低点特性,对于低温粘合至关重要.
特定的金属元素会影响接的性能和性能.
了解界面反应和机械性能是关键的关联可靠性.

结论:

低温多元件合剂对于最小化柔性电子产品3D包装中的热损伤至关重要.
对接口反应和机械性质的进一步研究将提高接关节的可靠性.
这些接器为更强大,更耐用的灵活电子设备铺平了道路.

关键词:

在这里,HEA.在IMC中,IMC是IMC.低温低温的低温是什么多元组件接器的接方式剪切强度剪切强度湿透性湿透性湿透性湿透性

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