化高电子移动性晶体管装置,具有集成的芯片上阵列连接点温度监测单元
Yukuan Chang1, Yue Su1, Mingke Xiao1
1School of Intelligent Science and Technology, Hangzhou Institute for Advanced Study, University of Chinese Academy of Sciences, Hangzhou 310024, China.
Micromachines
|March 27, 2025
概括
研究人员为化高电子移动性晶体管 (GaN HEMT) 设备开发了一种芯片上温度监测系统. 这种新的方法提供了实时的热分布见解,提高了设备的可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 化高电子移动性晶体管 (GaN HEMT) 对于高功率,高频应用至关重要.
- 精确的连接点温度监测对于确保GaN HEMT的可靠性和性能至关重要.
- 现有的温度监测方法可能缺乏实时的空间分辨率数据.
研究的目的:
- 开发一种新的芯片上方法,用于实时监测GaN HEMT设备的节点温度.
- 在操作过程中检查设备表面的热分布.
- 为了提高GaN电源设备的长期可靠性.
主要方法:
- 在GaN HEMT表面上喷图案的/白金 (Ti/Pt) 热敏电阻条.
- 构建一个芯片上阵列连接点温度监测单元.
- 根据热成像验证监控单元的准确性.
主要成果:
- 开发的芯片上单元提供了多个位置的实时温度感知.
- 温度监测单元显示温度电阻系数为0.183%/°C (25-205°C).
- 与热成像仪相比,集成单元在反映实时温度方面实现了超过95%的准确性.
结论:
- 新的芯片上温度监测系统有效地反映了GaN HEMT的热分布.
- 这种方法显著提高了交叉点温度监测的准确性和实时能力.
- 该技术对于在苛刻的应用中提高GaN电源设备的可靠性至关重要.
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