Pengfei Lin1, Kuan Lu1, ChaBum Lee1

  • 1J. Mike Walker '66 Department of Mechanical Engineering, Texas A&M University, 3123 TAMU, College Station, TX 77843-3123, United States.

Ultramicroscopy
|April 8, 2025
PubMed
概括

一种新方法使用红外激光衍射模式来测量透过电路 (TSV) 的关键尺寸. 这种非破坏性技术为半导体计量挑战提供了低成本,高效的解决方案.