Cu

Shuhong Dong1,2, Aoran Yang2, Yonghao Fu2

  • 1Jiangsu Key Laboratory of Advanced Food Manufacturing Equipment and Technology, Jiangnan University, 214122 Wuxi, P. R. China.

概括

在聚乙烯二甲 (PET) 上的铜 (Cu) 薄膜为5G应用提供了更高的灵活性和导电性. 分子动力学模拟和实验显示,与金属基板相比,PET基板产生更光滑,更粘的Cu薄膜.