一个阶段式门氧化物结构,用于抑制完全耗尽的在绝缘体上的多子通道道场效应晶体管中的门诱导的排水泄漏
Rui Chen1, Liming Wang1, Ruizhe Han1
1Laboratory of Analog Integrated Circuits, Hangzhou Institute of Technology, Xidian University, Hangzhou 311231, China.
Micromachines
|April 26, 2025
概括
一种新的阶段性门氧化物 (SGO) 结构有效地抑制完全耗尽的在绝缘器上多子通道道场效应晶体管 (MS TFET) 中的门诱导排水泄漏 (GIDL),显著降低了状态下电流和功耗.
科学领域:
- 半导体设备物理学 半导体设备物理
- 用于电子产品的先进材料.
- 新型晶体管架构的创新
背景情况:
- 门引起的排水泄漏 (GIDL) 在完全耗尽的在绝缘体 (FD-GeOI) 多子通道道场效应晶体管 (MS TFET) 中构成了重大挑战.
- 高的非状态泄漏电流导致静电消耗增加和设备性能降低.
- 现有的解决方案往往需要与其他关键设备参数进行权衡.
研究的目的:
- 提出和研究一个阶段式门氧化物 (SGO) 结构作为MSTFET中GIDL抑制的解决方案.
- 分析SGO几何学对设备性能指标的影响.
- 优化SGO设计以提高TFET特性.
主要方法:
- 使用准确的设备模型进行设备模拟.
- 系统地调查SGO厚度和长度的变化.
- 对SGO MS TFETs与传统和轻度注排水 (LDD) MS TFETs进行比较分析.
主要成果:
- 该SGO结构大大降低了离状态GIDL电流 (Ioff) 从4.6×10−7 A降至2.6×10−11 A.
- 实现了4.22级大小改善的状态到状态下电流比率 (Ion/Ioff).
- 显示了28%的下值摆动 (SS) 减少,32%的门容量减少,以及23%的载体移动性增强.
结论:
- 拟议的SGO结构是减轻FD-GeOI MS TFET中GIDL的有效策略.
- SGO设计在泄漏电流,功耗和整体设备性能方面提供了显著的改进.
- 这种方法为开发更高效,更可靠的TFET提供了可行的途径.
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