关于横断分门沟金属氧化物半导体场效应晶体管单事件影响硬化方法的研究
Mengtian Bao1,2, Ying Wang2, Jianqun Yang3
1School of Electronic Information, Huzhou College, Huzhou 313000, China.
Micromachines
|April 26, 2025
概括
重离子辐射导致功率MOSFET中的单次事件燃烧 (SEB). 一个新的过程优化使设备变硬,显著增加了SEB故障值电压,并改善了辐射耐受性.
科学领域:
- 半导体设备物理学 半导体设备物理
- 电子产品中的辐射效应.
- 动力电子产品的动力电子.
背景情况:
- 横向分裂门沟 (TSGT) 功率MOSFET在重离子辐射下容易发生单次事件燃烧 (SEB).
- 了解SEB机制对于在辐射环境中可靠运行电源设备至关重要.
研究的目的:
- 研究在重离子辐射下TSGT功率MOSFET中的SEB效应和降解.
- 提出和验证一个流程优化方法,以提高SEB的容忍度.
主要方法:
- 在120V级TSGT功率MOSFET上使用石离子进行重离子辐射试验.
- 实验测量SEB故障值电压 (V_SEB).
- 用TCAD模拟来分析降解机制并验证硬化效应.
主要成果:
- 最初的V_SEB在72V (52.6%的故障电压) 测量,并且随着流量增加而下降.
- 模拟确定了局部"热点"作为排水电流退化的原因.
- 拟议的工艺优化将V_SEB增加到115V (89.1%的故障电压),没有定制晶圆.
结论:
- 重离子辐射显著降低TSGT功率MOSFET,其中V_SEB是一个关键参数.
- 流程优化提供了一种有效的,没有晶圆的解决方案,以提高SEB的耐受性.
- 硬化设备在太空和高辐射应用中显示出更高的可靠性.
相关概念视频
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