一种新的建模和分析单元导热的单元导热的机械性能
Yuezhen Wang1, Xiaoguang Li2, Zhifeng Liu3,4
1School of Liberal Arts and Sciences, North China Institute of Aerospace Engineering, Langfang, 065000, China. wyz@nciae.edu.cn.
Scientific reports
|April 30, 2025
概括
单组件导热凝 (S-TCSG) 呈现出影响印刷电路板的机械缺陷. 这项研究描述了其缓冲,爬行和应力放松特性,以改善材料应用和板材性能.
科学领域:
- 材料科学 材料科学 材料科学
- 机械工程 机械工程
- 电子 包装 电子 包装
背景情况:
- 单组件导热凝 (S-TCSG) 用于高性能印刷电路板 (PCB) 包装.
- 由于S-TCSG的机械性能,在组装或冲击过程中可能导致PCB变形和接关节骨折.
研究的目的:
- 实验性地研究S-TCSG的机械性能,包括缓冲,爬行和应力放松.
- 建立S-TCSG在压缩和时间依赖机械反应中的行为模型.
- 分析凝厚度对螺丝紧固期间应力分布的影响,并开发一个预测性的数学模型.
主要方法:
- 压缩应力-应变试验,以建立缓冲系数,压缩应力和应变之间的关系模型.
- 关于压缩爬行和应力放松的实验研究,以确定时间变化的规律.
- 开发一个非线性有限元模型 (FEM) 来模拟S-TCSG行为.
- 分析凝厚度对螺丝拉紧过程中应力分布的影响.
主要成果:
- 基于压缩试验,建立了缓冲性能的关系模型.
- 实验数据提供了弹性模量,放松模量和爬行合规性.
- 创建了S-TCSG的非线性FEM,并分析了凝厚度对应力分布的影响.
- 提出了一个数学模型,将凝厚度,压力应力和位移负荷联系起来.
结论:
- 这项研究为S-TCSG的机械行为提供了关键的见解.
- 这些发现对于优化S-TCSG涂层厚度在PCB应用中具有重要意义.
- 该研究有助于提高印刷电路板的整体性能和可靠性.
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