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高集成的多重显微镜系统用于集成电路故障分析.

Haotian Li, Junliang Liu, Cheng Fei

|May 1, 2025

概括

此摘要是机器生成的。

本研究介绍了用于非破坏性半导体缺陷检测的先进光学复合系统. 集成系统快速识别集成电路故障,使得精确的根源原因分析.

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科学领域:

光电学是指光电子产品.
材料科学材料科学材料科学
半导体物理半导体物理

背景情况:

集成电路 (IC) 故障分析和半导体缺陷检测对于制造质量至关重要.
当前的检查方法可能缺乏高级分析所需的集成和非破坏性能力.
开发先进的光学系统对于提高缺陷识别的效率和准确性至关重要.

研究的目的:

为高度集成,非接触,非破坏性检查系统提供一种新的光学复合结构.
为了使集成电路中的高级故障分析和半导体缺陷检测成为可能.
用雪崩光探测器和多式联络检测来验证系统的功能.

主要方法:

该系统整合了四个子系统:明亮/暗场显微镜,辐射显微镜,激光共聚焦扫描显微镜和光共聚焦显微镜.
雪崩光探测器用于系统验证和分析.
检测过程包括定位发光设备,3D成像用于损伤评估和光寿命比较.

主要成果:

多式联机光学多重复合系统展示了有效的非接触和非破坏性检查能力.
该系统成功执行3D成像并分析光寿命,以识别故障机制.
经过功能验证,显示了快速准确地识别生产问题的潜力.

结论:

开发的光学复合结构为半导体缺陷检测提供了一个高度集成的系统.
这种多式联络方法可以快速准确地识别生产问题,并追踪故障的根本原因.
该系统为先进的集成电路故障分析提供了一个有前途的解决方案.