含量对热浸锡涂铜线溶解行为的影响和Cu-Sn金属间化合物层的演变
Qi Wang1, Jinhan Zhang1, Song Niu2
1Faculty of Materials Metallurgy and Chemistry, Jiangxi University of Science and Technology, Ganzhou 341000, China.
Materials (Basel, Switzerland)
|May 7, 2025
概括
将微量 (Ni) 添加到合金炼中,可以显著改善热浸工艺. 添加稳定了铜金属间层,延长了铜线溶解时间,增强了接口稳定性.
科学领域:
- 材料科学 材料科学 材料科学
- 金工业是金工业的一个方面.
- 表面工程是什么?表面工程是什么?
背景情况:
- 热锡工艺对于保护性涂层至关重要,但会受到不受控制的铜溶解和不稳定的接口的影响.
- 过度的铜溶解会导致缺陷和涂层性能降低.
- 接口不稳定性损害了制元件的完整性和寿命.
研究的目的:
- 为了研究微量 (Ni) 添加对铜溶解和热浸时的界面反应的影响.
- 阐明Ni添加调节铜溶解动力学和金属间化合物 (IMC) 层形成的机制.
- 评估Ni作为基浴中的稳定剂的潜力.
主要方法:
- 热锡化溶解实验是在合金融中的铜线上进行的,度不同 (0-0.5%).
- 微观表征技术 (例如,SEM,EDS) 用于分析界面IMC层的形态和组成.
- 进行了溶解动力学分析,包括激活能量的确定,以量化Ni.添加的影响.
主要成果:
- 的添加促进了 (Cu1-x,Nix) 6Sn5三元相的形成,改变了IMC层的粒状形态从等到纤维.
- 的存在显著改变了界面反应动力学,增加了溶解的激活能量.
- 激活能量从40.84kJ/mol (纯Sn) 增加到54.21kJ/mol (Sn-0.5Ni),使铜线溶解时间在573K时增加了三倍.
结论:
- 添加Trace Ni有效控制铜的溶解,并增强热浸锡的界面稳定性.
- Ni替代三元IMC相的形成是修改溶解行为的关键.
- 这项研究为优化锡浴提供了一条途径,以提高性能和可靠性.
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