推进热能储存:封装式抛PCM的合成和热性能
Raihana Jannat Adnin1, Han-Seung Lee2
1Department of Smart City Engineering, Hanyang University, 1271 Sa 3-dong, Sangnok-gu, Ansan-si 15588, Republic of Korea.
Molecules (Basel, Switzerland)
|May 7, 2025
概括
这项研究开发了用于热能存储的新型封装纳米相变材料 (NPCMs). 合成的材料显示出出色的热稳定性,高能储能能力和长期耐用性.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术纳米技术
- 化学工程是化学工程的重要组成部分.
背景情况:
- 变相材料 (PCM) 对于热能储存 (TES) 是至关重要的.
- 封装是必要的,以提高PCM的热稳定性和防止泄漏.
- 纳米封装为TES应用提供了增强的性能特性.
研究的目的:
- 用作为核心合成和表征封装的纳米相变材料 (NPCMs).
- 评估合成NPCMs的热性能,稳定性和能量储存能力.
- 评估这些NPCM在高效和可持续的热能储存方面的潜力.
主要方法:
- 合成SiO2封装式抛NPCMs的Sol-gel方法.
- 用于结构和化学验证的FTIR,XRD和XPS.
- SEM用于形态分析,TGA用于热稳定性,DSC用于热性能评估.
主要成果:
- 成功合成具有核心外结构的球形SiO2封装NPCM.
- PARSI-4 (4:1/SiO比率) 显示了最小的粒子大小 (190 nm) 和最高的度.
- 实现了高封装比率 (87.83%) 和效率 (87.04%),具有出色的热稳定性和100个循环后98.16%的度保留.
结论:
- 用SiO2封装的NPCM表现出增强的热稳定性和优越的储能性能.
- 合成的材料显示出出色的结构完整性和长期循环稳定性.
- 这些NPCM有望在可持续和节能应用中有效储存热能.
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