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化学交联的柔性聚合物相变材料具有自愈,自适应和形状记忆的特性,用于热接口应用

Linhao Sun¹, Yifan Huang¹, Wenjing Chen²

¹School of Advanced Manufacturing, Nanchang University, Nanchang 330031, China.

Journal of colloid and interface science

|May 13, 2025

概括

一种新的热接口相变材料 (TIPCM) 使用和SEBS被开发出来,为电子产品提供了增强的散热. 这种材料可以防止泄漏,自我修复,并显著提高导热率,以提高芯片性能.

科学领域:

材料科学材料科学材料科学
纳米技术纳米技术
化学工程是化学工程的重要组成部分.

背景情况:

有效的散热对于电子元件的高效运行至关重要.
阶段变换材料 (PCM) 对热管理具有前景,但往往存在泄漏问题.
开发先进的热接口材料 (TIM) 是克服这些局限性的关键.

研究的目的:

开发一种具有增强的导热性和结构完整性的新型热接口相变材料 (TIPCM).
为解决与传统PCM相关的泄漏问题.
提高电子元件的热管理能力.

主要方法:

化混合 (PW) 与 styrene-ethylene-butylene-styrene (SEBS) 并将二过氧化物作为交叉连接剂.
形成一个交叉连接的PW-SEBS网络,以保持PW点以上的结构完整性.
包含化 (BN) 作为导热填充剂.

主要成果:

在PW的化温度以上,TIPCM保持了结构完整性,防止泄漏.
该材料的自我愈合能力高达其原始状态的70%.
添加BN使导热率提高了348.14%,拉力断裂延长率为129.1%.

结论:

开发的TIPCM为电子设备的热管理提供了强大的解决方案.
它的独特特性,包括防泄漏,自我愈合,高热导率和灵活性,使其适合苛刻的应用.
TIPCM显著降低了芯片温度,为先进的热管理解决方案提供了新的途径.

关键词:

适应性的适应性的灵活的灵活的它可以自我治愈.热接口相变材料是热接口的相变材料.热管理是一种热管理.

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