双频段过器和双器设计使用极为小型化的基板集成的同轴腔
Chun-Ming Hung1, Ci-Fang Jheng2, Keh-Yi Lee3
1Universal Microwave Technology Inc., Keelung 206, Taiwan.
Sensors (Basel, Switzerland)
|May 14, 2025
概括
本研究介绍了一种小型化的基板集成同轴腔 (SICC) 用于5G过器和双复合器. 新型SICC结构显著减少了电路面积,同时保持了5G应用的高性能.
科学领域:
- 电气工程 电气工程
- 电磁学 电磁学 电磁学 电磁学
- 微波工程 微波工程
背景情况:
- 5G通信系统需要高效的前端和信号切换组件.
- 传统的基板集成波导 (SIW) 腔占据了相当大的空间.
- 微型化对于将高级功能集成到紧型设备中至关重要.
研究的目的:
- 为5G应用设计和验证一个高度缩小的双频段过器 (DBF) 和一个双器.
- 为了引入一种新的基板集成同轴腔 (SICC) 共振器.
- 与现有的基于SIW的设计相比,实现更高的电路面积效率.
主要方法:
- 开发一个小型的基板集成同轴腔 (SICC) 共振器.
- 使用两个SICC共振器实现双频段过器.
- 使用三个SICC共振器实现双器.
- 设计结合了传输零点以提高选择性,并实现了高隔离率 (>20 dB).
主要成果:
- 拟议的SICC结构仅占据相同频率的传统SIW空洞面积的2.1%.
- 制造的双带波器和双波器样本显示模拟和测量数据之间的良好一致.
- 这些设计实现了高性能指标,包括选择性和隔离性.
结论:
- 开发的SICC技术为5G系统提供了高度缩小的射频组件的途径.
- 这份工作介绍了迄今为止最有效的电路面积的双带SIW空腔过器和双器.
- 拟议的基于SICC的过器和双器适合集成到紧的5G设备中.
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