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在当代电子设备包装中接和粘合
Yuxuan Li1, Bei Pan1, Zhenting Ge1
1Nanjing Electronic Devices Institute, Nanjing 210000, China.
Materials (Basel, Switzerland)
|May 14, 2025
概括
本文详细介绍了电子包装接和粘合技术,包括晶圆,模具和电线粘合. 它强调了先进的方法,如用于3D-SiP包的翻转芯片和撞击粘合.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体制造业 半导体制造业
背景情况:
- 电子包装对于将芯片转化为功能设备至关重要.
- 接和粘合是电子包装组装中的基本过程.
- 不断发展的包装架构需要接和粘合技术的进步.
研究的目的:
- 提供电子包装中接和粘合技术的全面概述.
- 详细介绍各种晶圆粘合,模具附着和电线粘合方法.
- 讨论 bump bonding 对 3D-SiP 包的意义和新兴趋势.
主要方法:
- 介绍直接和间接的晶圆粘合技术.
- 详细解释了五个模具附着过程.
- 深入描述电线粘合中的球粘合和形粘合.
- 探索翻转芯片粘合和凸起制造方法的探索.
主要成果:
- 传统和先进的接/粘合工艺对于设备包装至关重要.
- 碰撞粘合,特别是铜碰撞技术,是3D-SiP先进包装的一个关键领域.
- 表面安装和密封技术在电子设备组装中也很重要.
结论:
- 这篇论文为电子包装研究人员提供了有关当代接和粘合实践的宝贵见解.
- 了解这些技术对于开发先进的电子设备和系统至关重要.
- 继续研究粘合技术,特别是3D集成技术,对于未来的进步至关重要.
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