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对高带宽共包光学液体冷却热管理的模拟和实验研究
Senhan Wu1,2,3, Song Wen2, Huimin He1,2
1State Key Laboratory of Fabrication Technologies for Integrated Circuits, Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China.
Frontiers of optoelectronics
|May 14, 2025
概括
冷板液体冷却有效地管理共包装光学 (CPO) 系统中的热量. 该技术通过保持开关芯片和光学模块的最佳工作温度来确保高容量CPO的可靠性.
科学领域:
- 光电学是指光电子产品.
- 热管理 热管理
- 数据中心技术 数据中心技术
背景情况:
- 共包装光学 (CPO) 在单个基板上集成光学模块和交换机芯片,减少电气互连,以获得更高的带宽.
- 在CPO中高度集成会增加功率密度和热交叉声,给可靠性带来重大热管理挑战.
- 传统的可插入光学模块在高带宽下面面临电力消耗和信号完整性的限制.
研究的目的:
- 分析独特的CPO架构的特定散热要求.
- 为高容量CPO系统设计和优化冷板液体冷却热管理方案.
- 通过模拟和实验测试来验证拟议的液体冷却解决方案的有效性.
主要方法:
- 基于其集成架构的CPO散热需求的详细分析.
- 冷板液体冷却热管理方案的设计.
- 使用纳维尔-斯托克斯方程模拟热管理方案,并在热测试平台上进行实验验证.
主要成果:
- 对51.2 Tbit/s CPO系统的模拟显示开关芯片连接温度为97.3°C,光学模块温度低于31.3°C.
- 实验结果证实了模拟的准确性,温度差异在4%以内,压力趋势一致.
- 设计的散热器成功地满足了51.2 Tbit/s CPO系统的热量需求.
结论:
- 冷板液体冷却技术是应对高容量CPO的热挑战的可行解决方案.
- 该研究为先进的WDM系统中光电子集成的可靠性提供了理论和实践基础.
- 这项研究支持在CPO中推进液体冷却应用,这对于下一代光通信网络至关重要.
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