基于GaN的金属绝缘体半导体设备的接口缺陷被动化通过现场组合等离子体预处理
Xiaohong Zeng1,2, Ying Wu1, Jinteng Zhang3
1School of Integrated Circuits, Nanjing University, Suzhou 215163, China.
ACS applied materials & interfaces
|May 15, 2025
概括
综合性等离子体预处理显著改善化 (GaN) 金属绝缘体半导体设备. 这种方法减少了接口缺陷,提高了动力电子的性能和可靠性.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 表面科学是一门学科.
背景情况:
- 基于化 (GaN) 的金属绝缘体半导体 (MIS) 设备对于高性能功率电子设备至关重要.
- 门介电半导体连接处的接口缺陷限制了GaN MIS设备的性能和可靠性.
研究的目的:
- 调查现场H2,N2和N2/H2等离子体预处理对GaN表面的影响.
- 开发和评估用于GaN表面被动化的联合等离子处理方法.
主要方法:
- 使用超高真空互连系统进行现场等离子体治疗.
- 在现场使用X射线光电子光谱 (XPS) 和阴极发光 (CL) 进行表面分析.
- 进行了ex situ原子力显微镜 (AFM) 和电容电压 (C-V) 测量.
主要成果:
- 联合等离子体预处理有效地减少了GaN表面上的碳和氧杂质.
- 空缺和深层缺陷被补偿和被动化.
- 接口缺陷密度减少了近一个数量级,显著提高了电气性能.
结论:
- 综合性等离子体预处理提供了一种非破坏性的方法来提高GaN表面质量.
- 这种方法显著提高了GaN MIS设备的电气特性和可靠性.
- 这些发现支持基于GaN的先进半导体技术的更广泛应用.
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