通过材料和接口工程,推进电源半导体的热管理技术
Man Li1, Suixuan Li1, Zhihan Zhang1
1School of Engineering and Applied Science, University of California, Los Angeles (UCLA), Los Angeles, California 90095, United States.
概括
研究人员开发了新的材料和方法来改善功率电子产品中的散热. 创新包括超高导热材料,如化和动态热管理解决方案,提高设备性能和寿命.
科学领域:
- 材料科学与工程 材料科学与工程
- 固态物理 固态物理
- 热管理 热管理
背景情况:
- 功率半导体对于现代电子产品至关重要,但由于功率密度高,因此面临着重大的热管理挑战.
- 有效的散热对于功率电子的性能,可靠性和寿命至关重要.
- 现有的热管理解决方案与声子,电子和材料接口的复杂相互作用作斗争.
研究的目的:
- 为了突出功率半导体和芯片的热管理方面的进步.
- 介绍新的材料和接口工程策略,以提高散热.
- 探索动态热管理解决方案和热传输的新原则.
主要方法:
- 开发具有超高导热性的材料,包括化和化.
- 声波带结构工程,以减少半导体接口中的热边界电阻 (TBR).
- 创建自组装的化复合材料,用于改进芯片到散热器接口.
- 开创了用于动态热管理的固态热晶体管.
主要成果:
- 化和化实现了高达1300W/mK的创纪录的导热率.
- 与GaN/钻石接口相比,GaN/BAs接口的TBR降低了8倍以上.
- 开发了符合标准的化复合材料,具有高导热率 (21W/mK),用于灵活的电子产品.
- 展示了用于电气控制热流的固态热晶体管.
结论:
- 开发的材料和技术显著降低了热点温度,并为功率电子产品的热设计设定了新的基准.
- 创新提高了热性能,使新型运输物理学的探索成为可能,并改善了对热能运输的基本理解.
- 未来的工作包括扩大生产规模,整合解决方案,以及为下一代动力电子产品发现新物理.
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