Ag和融化低冷对Sn-Ag球微观结构的影响
Sihan Sun1, Ao Li1, Chao Cheng1
1Department of Materials, Imperial College London, London, SW7 2AZ UK.
概括
这项研究绘制了接关节的微观结构图,揭示了银含量和冷却如何影响锡银 (Sn-Ag) 接球的固化. 这些发现指导了接微结构的定制,以提高机械性能.
科学领域:
- 材料科学 材料科学 材料科学
- 固化科学 固化科学 固化科学
- 电子材料 电子材料
背景情况:
- 电子接接头通过冷却不足的融体的固化形成微观结构.
- 锡银 (Sn-Ag) 合金对于电子包装至关重要.
- 了解固化行为是控制接关节特性的关键.
研究的目的:
- 将固化微结构选择图 (SMSM) 应用于Sn-Ag球上.
- 研究银 (Ag) 含量和融化低冷对微观结构形成的影响.
- 为了建立一个框架来定制接微结构的机械性能.
主要方法:
- 使用的Sn-Ag接球具有0.5-5.0重量%Ag.
- 应用了从10-70 K.到70 K.的散装低温.
- 开发和修改SMSM以考虑β-Sn和Ag3Sn相的竞争性核化.
主要成果:
- 根据Ag含量和低冷却,揭示了从单颗粒到循环双胞胎微结构的过渡.
- 观察到锡树和体生长之间的竞争,由Ag含量和核化控制.
- 经过修改的SMSM和合区理论之间的证明一致.
结论:
- 修改后的SMSM为Sn-Ag接微结构提供了一个预测工具.
- 控制β-Sn和Ag3Sn的核化低冷对于定制机械性能至关重要.
- 这项研究为设计强大的电子接接头提供了一份指南.
更多相关视频
04:09Demonstrating the Simplicity and In Situ Temperature Monitoring of the Mechanochemical Synthesis of Metal Chalcogenides Suitable for Thermoelectrics
Published on: August 30, 2024
446
14:51An Available Technique for Preparation of New Cast MnCuNiFeZnAl Alloy with Superior Damping Capacity and High Service Temperature
Published on: September 23, 2018
7.1K
相关概念视频
Colloidal precipitates
782
The high insolubility of some precipitates can result in an unfavorable relative supersaturation. This can lead to colloidal particles with a large surface-to-mass ratio, where adsorption is promoted. For instance, in the precipitation of silver chloride, silver ions are adsorbed on the surface of the colloidal particles, forming a primary layer. This layer attracts ions of opposite charge (such as nitrate ions), forming a diffuse secondary layer of adsorbed ions. This electric double layer...
782
Bonding in Metals
48.2K
Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”.
48.2K
