研磨参数对表面粗度和地下裂损伤深度的影响 蓝宝石水晶的深度
Yingqi Hou1, Yufei Gao1,2,3, Chunfeng Yang1
1Key Laboratory of High Efficiency and Clean Mechanical Manufacture of MOE, School of Mechanical Engineering, Shandong University, Jinan 250061, China.
Materials (Basel, Switzerland)
|June 13, 2025
概括
磨砂蓝宝石水晶需要去除易碎的材料,影响表面粗度 (Ra) 和地下裂损伤 (SSD). 优化的参数将Ra降低到0.326微米,SSD降低到2.86微米.
科学领域:
- 材料科学 材料科学 材料科学
- 制造业 工程 制造工程
- 晶体加工 晶体加工
背景情况:
- 单晶蓝宝石晶体在LED,激光器和光学系统等先进技术中至关重要.
- 研磨是蓝宝石晶体组件的关键加工过程.
- 了解研磨参数对于获得高质量的蓝宝石表面至关重要.
研究的目的:
- 为了研究研磨轮速度,深度和料速度对蓝宝石晶体表面质量的影响.
- 分析表面粗度 (Ra) 和地下裂损伤深度 (SSD).
- 建立预测模型并确定最佳的研磨参数.
主要方法:
- 设计并执行了一个三因素,五级直角实验.
- 对实验数据进行了差异和范围分析.
- 功率回归模型被开发用于Ra和SSD预测.
主要成果:
- 研磨的结果是柔性和脆性材料的混合去除,导致表面坑和地下微裂.
- 研磨轮速度对Ra和SSD的影响最大,其次是料速度和研磨深度.
- 最佳参数产生了0.326μm的表面粗度 (Ra) 和2.86μm的SSD.
结论:
- 这项研究为优化蓝宝石晶体研磨工艺提供了关键数据.
- 这些发现有助于改善表面质量和减少地下破坏.
- 这项研究为增强蓝宝石晶体加工提供了一个实验基础.
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