基于ALD-ITZO薄膜晶体管的2T0C DRAM的保留和耐久性分析
Jingxuan Wei1, Yu Zhang2, Nannan Li2
1Fudan University, Handan Road 220, Yangpu Disctrict, Shanghai, Shanghai, 200433, CHINA.
Nanotechnology
|June 25, 2025
概括
印锡氧化物 (ITZO) 金属氧化物半导体使得先进的电容量少两晶体管 (2T0C) DRAM. 这种新的3D DRAM架构提供了比传统设计更好的性能和可扩展性.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 传统的1T1C DRAM在10nm节点附近面临可扩展性限制.
- 3D堆叠DRAM架构对于提高存储容量和集成至关重要.
- 无电容两晶体管 (2T0C) DRAM为3D集成提供了一种新的方法.
研究的目的:
- 调查氧化 (ITZO) 作为2T0C DRAM的通道材料的潜力.
- 为了制造和描述ITZO薄膜晶体管 (TFT) 和2T0C DRAM设备.
- 评估基于ITZO的2T0C DRAM在保留,耐久性和操作窗口方面的性能.
主要方法:
- 使用原子层沉积 (ALD) 制造ITZO TFT和2T0C DRAM设备.
- 薄膜特性和设备性能的全面表征.
- 评估保留时间,耐久性 (程序删除周期) 和操作电压窗口.
主要成果:
- ITZO TFT 显示了 10^6 的高离子/Ioff 比率和低泄漏电流 (10^-5 μA/μm).
- 2T0C DRAM 设备的保留时间从 10 到 100 秒,耐用性为 10^5 周期,5.05 V 操作窗口.
- 在ITZO TFT传输特征中明显的"0"读取状态表明了2T0C DRAM操作状态的新分类.
结论:
- ITZO是高性能2T0C DRAM的有希望的材料,在TFT应用中超过了IGZO.
- 制造的2T0C DRAM设备显示了未来内存应用的竞争性性能指标.
- 在ITZO TFT中观察到的独特的操作状态要求进一步调查新的DRAM功能.
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