:

Mengyang Su1, Jin Huang1, Hongxiao Gong1

  • 1State Key Laboratory of Electromechanical Integrated Manufacturing of High-Performance Electronic Equipments, Xidian University, Xi'an 710071, China.

Micromachines
|June 27, 2025
PubMed
概括

本研究介绍了一种添加减去制造方法,使用水溶性牺牲层来改善柔性电子产品的金属薄膜粘附性. 与传统喷墨印刷相比,这种新技术显著提高了粘合强度.

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