在 Sn 和电 Co-Zn 合金之间的反应期间的界面行为
Chao-Hong Wang1, Che-Yang Lin1
1Department of Chemical Engineering, National Chung Cheng University, Chiayi 621301, Taiwan.
Materials (Basel, Switzerland)
|June 27, 2025
概括
将 (Zn) 添加到 (Co) 电涂层中,可以显著改变 (Sn) 合金的金属间化合物 (IMC) 形成. 较高的含量有效抑制IMC的生长,增强界面稳定性.
科学领域:
- 材料科学 材料科学 材料科学
- 电化学 电化学 电化学
- 表面工程是什么?表面工程是什么?
背景情况:
- -锡 (Co-Sn) 金属间化合物 (IMC) 在电子包装中至关重要.
- 控制IMC形成对于可靠的接关节性能至关重要.
- 电为制造Co-Zn合金涂层提供了一种多功能方法.
研究的目的:
- 为了研究Co-Zn合金涂层的电特性.
- 为了检查Zn含量变化的影响IMC形成与Sn接.
- 为了评估Co-Zn/Sn接接头的界面稳定性.
主要方法:
- 通过对控制的 Zn 度进行电,制造 Co-Zn 合金涂层.
- 使用先进技术分析涂层形态,微观结构和结晶性.
- 研究液态 (250°C) 和固态 (160°C) 与Sn接的界面反应.
主要成果:
- 在电过程中观察到Zn与Co异常的共同沉积.
- Zn的结合破坏了Co的结晶性,导致结晶性降低和无形化.
- 较高的含量显著降低了IMC的形成,特别是在固态反应 (>85%抑制) 中.
- 同-Zn涂层表现出与Sn接剂的改善界面稳定性.
结论:
- 兴奋剂是一种有效的策略来控制和抑制CoSn3 IMC形成.
- 同-Zn合金涂层提高了Sn接接头的界面稳定性.
- 优化的Co-Zn涂层对先进的电子包装应用具有前途.
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