通过高-κ介电介质和使用单脉冲电荷送的接口陷提取增强InGaZnO晶体管电流
JaeHyeong Park1,2, Hyo-Bae Kim3, Sang Min Yu1,4
1Department of Electrical and Electronic Engineering, Hanyang University, Ansan, 15588, Korea.
Scientific reports
|July 2, 2025
概括
在氧化物半导体晶体管中增加驱动电流是更好的显示器和更快的内存的关键. 这项研究表明,虽然高-κ介电剂提高了性能,但接口陷限制了收益,凸显了减少它们的必要性,以实现最佳的设备增强.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 设备工程 设备工程
背景情况:
- 在氧化物半导体晶体管中增强驱动电流对于高分辨率显示器和更快的内存等先进电子设备至关重要.
- 高流动性材料可以改善电流,但会给制造带来挑战;因此,在不改变通道材料的情况下改善电流是可取的.
- 高-κ 门介电 offers 提供了一条提升门电容和晶体管性能的途径.
研究的目的:
- 系统地研究不同高-κ门介电剂对氧化 (InGaZnO) 晶体管性能的影响.
- 在使用高-κ介电材料时,确定限制驱动电流增强的因素.
- 量化界面陷的作用,并提出减少它们的方法.
主要方法:
- 使用SiO2,HfO2和ZrO2门绝缘体的InGaZnO晶体管的制造和电气表征.
- 对门绝缘器的介电常数 (κ) 相对于驱动电流增强的分析.
- 设备模拟以了解接触电阻,通道容量和接口陷密度的相互作用.
- 使用单脉冲电荷送方法量化接口陷密度.
主要成果:
- 驱动电流随着介电常数的提高而增加,但低于仅基于 κ 的理论预测.
- 与SiO2 (κ=3.9) 相比,HfO2 (κ=17) 和ZrO2 (κ=30) 分别显示了2.8x和7x的驱动电流增强,与SiO2 (κ=3.9) 相比.
- 设备模拟和实验确定了接口陷密度作为主要限制因素,特别是对于HfO2.2.
- 单脉冲充电送证实了HfO2的高接口陷密度,与减少的传导率相关.
结论:
- 虽然高-κ介电剂有效地增加门电容,但它们增强InGaZnO晶体管驱动电流的全部潜力受到接口陷密度的显著限制.
- 减少接口陷对于最大限度地利用高-κ介电物的好处,并实现大幅度的驱动电流改进至关重要.
- 这项研究为优化氧化物半导体晶体管提供了一条途径,侧重于介电选择以及接口工程.
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