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Thermal Stress

Thermal Stress

If the temperature of an object is changed while it is prevented from expanding or contracting, the object is subjected to stress. The stress is compressive if the object expands in the absence of constraint and tensile if it contracts. This stress resulting from temperature change is known as thermal stress. It can be quite large and can cause damage. To avoid this stress, engineers may design components so they can expand and contract freely. For instance, on highways, gaps are deliberately...

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Updated: Jun 16, 2026

Thermal Measurement Techniques in Analytical Microfluidic Devices

Thermal Measurement Techniques in Analytical Microfluidic Devices

Published on: June 3, 2015

在微板中同时进行热分析 (STA).

Yuhang Yang^1,2, Zechun Li^1,2, Ruomeng Guo¹

¹State Key Lab of Transducer Technology, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai 200050, China.

Analytical chemistry

|July 11, 2025

概括

这项研究引入了一种微电子机械系统 (MEMS) 芯片,用于同时进行热分析 (STA),使得高度灵敏的微克级质量检测和精确的温度监测成为可能. 这一创新提高了热分析的效率和安全性,特别是对于危险材料.

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Thermal Measurement Techniques in Analytical Microfluidic Devices

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科学领域:

材料科学材料科学材料科学
分析化学分析化学
微型技术微型技术

背景情况:

同时热分析 (STA) 对于材料表征,测量重量和热变化至关重要.
现有的商业STA工具在敏感性和应用范围方面面临限制.
微电子机械系统 (MEMS) 技术提供了小型化和性能增强的潜力.

研究的目的:

开发一种新的基于MEMS的单立体集成共振微板芯片,用于芯片上的STA.
为了实现高灵敏度的同时热重力测量分析 (TGA) 和差异热分析 (DTA).
为了证明芯片在材料特性和危险物质分析方面的能力.

主要方法:

使用MEMS技术制造一个单体集成共振微板芯片.
通过共振微板频率变化 (0.32 ng分辨率) 在芯片上同时测量TGA.
在芯片上同时测量DTA,使用集成的多热电偶 (灵敏度为2.1mV/°C) 和功率响应 (2.3V/W).

主要成果:

该MEMS芯片实现了高灵敏度质量检测 (0.32 ng分辨率) 和准确的温度监测 (2.1 mV/°C).
实验验证使用金属标准和氧化单酸盐证实了提高效率和精度.
微克级别的检测能力允许对TNT等爆炸性材料进行安全分析,减轻与较大的样本大小相关的风险.

结论:

开发的MEMS芯片在集成和微型化热分析技术方面取得了重大进展.
这一创新为STA流程的实时可视化提供了一个新的平台.
该技术在材料表征和危险物质测量方面具有相当大的应用价值.