在CMOS兼容的在绝缘体上的造工艺中制造的挥发性和非挥发性纳米电子机械开关
Yingying Li1, Simon J Bleiker1, Elliott Worsey2
1KTH Royal Institute of Technology, 11428, Stockholm, Sweden.
Microsystems & nanoengineering
|July 11, 2025
概括
这项研究展示了可以使用商业造厂制造的纳米电机 (NEM) 开关. 这些NEM交换机为先进的计算和内存应用提供高能效.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 纳米技术纳米技术
背景情况:
- 纳米电子机械 (NEM) 开关提供零泄漏电流和突然切换,非常适合在极端环境中的节能数字电路.
- 由于可靠制造和现有半导体造厂内大规模集成的挑战,NEM交换机的商业可行性受到阻碍.
研究的目的:
- 为了展示 (Si) NEM开关的集成,使用商业在绝缘体 (SOI) 造平台.
- 克服制造高密度,高性能基于NEM的逻辑电路和非易失性内存的制造障碍.
主要方法:
- 使用了iSiPP50G商用SOI造平台,采用200nm以下的光刻法.
- 实现了两种类型的单体Si NEM开关:一个3终端 (3-T) 挥发性开关和一个7终端 (7-T) 双稳定开关.
- 根据接触设计研究的开关行为 (挥发性/非挥发性).
主要成果:
- 在商业SOI平台上成功制造了单立体集成Si NEM开关.
- 为3T NEM开关实现了5.6V的低启动电压.
- 在7-T NEM开关中表现出波动性和非波动性开关特性.
结论:
- 已建立的CMOS兼容的SOI造工艺可以用于可扩展的Si NEM交换机制造.
- 这项工作消除了对高密度的基于NEM的可编程逻辑和非挥发性内存设备的商业化的一个重大障碍.
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