在III-化物表氧中,二维缓冲破裂基质极限在III-化物表氧
Yimeng Sang1,2, Xiangming Xu3, Ying Wu1
1School of Integrated Circuits, Nanjing University, Suzhou 215163, China.
Science advances
|July 23, 2025
概括
研究人员开发了一种新的表层氧化方法,在无形二氧化基板上生长单晶化 (GaN) 薄膜. 这一突破使新的半导体设备能够通过克服以前的基板限制来实现.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体物理 半导体物理
- 纳米技术纳米技术
背景情况:
- 电子和光电子设备的异质整合需要多种不同的基板材料来生长单晶薄膜.
- 目前的方法仅限于具有匹配晶格的基板,限制了非单晶材料的使用.
- 无形二氧化 (SiO2) 是一种有吸引力的低成本基质,但缺乏适合常规表的晶体结构.
研究的目的:
- 在无形二氧化 (SiO2) 基板上开发高质量的单晶化 (GaN) 晶圆尺度生长的表化策略.
- 为了克服半导体异质集成中的格子匹配限制.
- 为了使先进的电子和光电子设备能够使用非单晶基板.
主要方法:
- 采用了一种涉及化学键过渡的新型表皮氧化策略.
- 多层二硫化物 (MoS2) 被转化为化 (MoN),作为缓冲层.
- 该MoN缓冲层设计了随后的GaN表层的首选方向.
主要成果:
- 在无形SiO2基板上成功生长了高质量的单晶GaN.
- 制造了一个AlGaN/AlN/GaN异构结构,具有高电子流动性 (>2000 cm2/Vs).
- 由此产生的高电子流动性晶体管表现出与商业设备可比的性能.
结论:
- 开发的表层氧化策略使单晶GaN在无形基板上生长,扩大了半导体制造的材料选择.
- 这种方法促进了先进的电子和光电子设备的异质集成.
- 该方法有可能实现高性能半导体器件的经济高效生产.
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