在GaN-on-Diamond高电子流动性晶体管中的接口驱动电热降解
Huanran Wang1, Yifan Liu1, Xiangming Dong1
1Institute of Micro/Nano Electromechanical System and Integrated Circuit, College of Mechanical Engineering, State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University, Shanghai 200051, China.
在GaN-钻石接口的热极限电阻显著影响GaN高电子流动性晶体管 (HEMT). 优化接口质量对于有效的热管理和提高设备性能至关重要.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 钻石的高导热性使其成为GaN HEMTs的理想选择.
- 在GaN-钻石接口的热极限电阻 (TBR) 限制了散热.
- 自热和性能降低是GaN-on-diamond HEMT中的关键问题.
研究的目的:
- 研究热边界层 (TBL) 厚度和导热率对GaN-on-diamond HEMT的影响.
- 在不同的接口条件下分析电热行为.
- 确定接口质量与基板导热率的相对重要性.
主要方法:
- 技术使用了计算机辅助设计 (TCAD) 模拟.
- 对TBL厚度 (5-20nm) 和导热率 (0.1-1.0W/m·K) 的系统研究.
- 基板导热性和接口质量的联合分析.
主要成果:
- 增加TBL厚度或减少TBL导热率会提高热点温度并降低电子的移动性.
- 设备性能随着较差的接口热特性而显著恶化.
- 接口TBR对设备行为的影响比基板导电性更大.
结论:
- 接口工程对于GaN-on-diamond HEMTs的热管理至关重要.
- 优化的接口可以补偿较低的基板导热率.
- 这些发现为未来关于声子传输和缺陷控制热接口的研究提供了基础.
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