在热电合下,Sn颗粒方向对纯Sn接接头的微观结构和机械性能的影响
Wenjia Zhao1, Keke Zhang2,3, Yanzhen Zhang1
1School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang, 471000, China.
Scientific reports
|July 28, 2025
概括
贝塔锡颗粒的方向在电流下显著影响Sn/Cu微接接头. 较小的角度导致不对称的金属间化合物生长和阴极断裂,而较大的角度提高关节可靠性和转移断裂模式.
科学领域:
- 材料科学 材料科学 材料科学
- 固体力学 固体力学是什么
- 可靠性工程可靠性工程
背景情况:
- 在电子包装中,Sn/Cu微接接头至关重要.
- 热电合和电迁移效应影响联合可靠性.
- 贝塔 (β-Sn) 粒的方向是一个关键的微观结构因素.
研究的目的:
- 为了研究β-Sn粒度方向对热电合下Sn/Cu微接接头的影响.
- 分析由此产生的微观结构,金属间化合物 (IMC) 形成和机械性能.
- 了解断裂机制和可靠性影响.
主要方法:
- 制造具有控制的β-Sn方向的Sn/Cu微接接头.
- 热电合条件的应用以诱导电迁移.
- 微结构分析 (例如,IMC层表征) 和剪切测试.
- 断裂表面分析以确定故障机制.
主要成果:
- 电流和c轴之间的较小角度 (θ ≤ 43.5°) 导致了显著的阴极溶解和不对称的IMC增长.
- 较大的角度 (θ = 78.1°) 导致压抑的阴极溶解和更均的IMC形成.
- 电迁移诱导的剪切断裂发生在阴极接口上,因IMC溶解而加剧.
- 较大的 θ 角度减少了剪强度降解和转移断裂位置,改变了断裂模式.
结论:
- 在Sn/Cu接接头中,β-Sn粒度定向对IMC生长和电迁移行为进行了批判性控制.
- 优化β-Sn方向可以减轻阴极溶解,增强界面粘合强度,提高关节可靠性.
- 断裂机制从脆性转变为柔性随着 θ 角的增加,表明断裂性得到改善.
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