损坏机制分析高场应力在cascode GaN HEMT电源设备上的高场应力
Shuo Su1,2, Yanrong Cao1,2, Weiwei Zhang1,2
1School of Electronics & Mechanical Engineering, Xidian University, Xi'an 710071, China.
Micromachines
|July 30, 2025
概括
处于非状态的GaN HEMT电源设备中的高场应力会导致物质损坏和充电陷. 这项研究揭示了影响设备可靠性和在恶劣环境中的性能的降解机制.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 半导体物理 半导体物理
背景情况:
- 化高电子移动性晶体管 (GaN HEMT) 电源设备对于现代电子产品至关重要.
- 州外高场应力可能会导致物质损坏和电荷捕获,损害设备的可靠性.
- 了解这些降解机制对于确保电力电子系统的稳定性至关重要.
研究的目的:
- 为了研究Cascode GaN HEMT电源设备在非状态高场应力下降解机制.
- 分析这种压力对设备性能和可靠性的影响.
- 为改善高要求应用程序中的GaN HEMT可靠性提供理论基础.
主要方法:
- 在Cascode GaN HEMT设备上应用非状态高场应力.
- 在氧化物层内分析电荷捕获现象.
- 检查屏障和缓冲层中缺陷形成的情况.
- 值电压转移和传导率减少的表征.
主要成果:
- 状态之外的高场应力会在MOS设备的氧化物层中诱导正电荷陷,这些陷位于级联结构内的氧化物层.
- 在GaN HEMT设备的屏障和缓冲层中观察到缺陷.
- 测量了值电压的负转移和传导率的减少.
结论:
- 这项研究阐明了Cascode GaN HEMT电源设备在非状态高场应力下损坏的机制.
- 已识别的降解途径为设备故障模式提供了关键的见解.
- 这项研究提供了一个基本的理解,以提高在具有挑战性的操作条件下GaN HEMT的可靠性.
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