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低相噪声,双频穿孔MEMS振荡器与直接打印增材制造的放大器电路

Liguan Li¹, Di Lan², Xu Han³

¹Department of Electrical Engineering, University of South Florida, 4202 E. Fowler Avenue, Tampa, FL 33620, USA.

|July 30, 2025

概括

三维 (3D) 打印增强了微电子机械系统 (MEMS) 振荡器. 与传统的印刷电路板 (PCB) 实现相比,3D打印的烯丁乙 styrene (ABS) 基板可以改善相位噪声和输出功率.

科学领域:

电气工程电气工程
材料科学材料科学材料科学
机械工程机械工程

背景情况:

微电子机械系统 (MEMS) 共振器为稳定的频率产生提供高质量因子 (Q).
传统的印刷电路板 (PCB) 基板可以引入寄生效应,影响射频 (RF) 性能.
三维 (3D) 打印为电子包装提供了新的基板解决方案.

研究的目的:

为了证明和比较MEMS振荡器在传统PCB和3D打印的烯乙烯乙烯 (ABS) 基板上的性能.
评估3D打印芯片载体包装对振荡器相位噪声和输出功率的影响.
在MEMS振荡器中,比较 (SiGe) 异质连接双极晶体管 (HBT) 和增强模式假形态高电子流动性晶体管 (E-pHEMT) 的相位噪声特性.

主要方法:

在在绝缘体 (SOI) 晶片上使用压电氧化 (ZnO) 振荡器制造相同的微电机械系统 (MEMS) 振荡器.
在传统的印刷电路板 (PCB) 和3D打印的烯丁乙烯 (ABS) 基板上实施振荡器.
先进的包装技术,包括精确的3D打印封装,具有100微米以下的横向互连,用于模块化表征.

主要成果:

振荡器在没有额外电路的情况下同时在双频 (260MHz和437MHz) 上运行.
与基于PCB的版本相比,3D打印的基于ABS的振荡器显示相位噪声在2-3dB的改善.
3D打印的振荡器实现了更高的输出功率 (在260MHz时为4.575dBm,在437MHz时为0.147dBm).
与E-pHEMT相比,日耳曼 (SiGe) 异质连接双极晶体管 (HBT) 在1kHz偏移下改善了11dB的相位噪声.

结论:

三维 (3D) 打印的芯片载体包装显著提高了MEMS振荡器的性能,提供了更好的相位噪声和输出功率.
3D打印的烯丁乙烯 (ABS) 基板的较低的介电损失和减少的寄生效应是提高性能的关键.
先进的3D打印包装技术可用于高性能MEMS振荡器应用,确保包装完整性而不影响射频性能.

关键词:

在MEMS MEMS中使用.添加剂制造添加剂制造添加剂制造先进的包装,先进的包装.振荡器的振荡器是一种振荡器.阶段噪声阶段噪声这是一种压电式电体.质量因素是质量因素.响应器响应器响应器在绝缘体上的 (SOI)氧化 (ZnO) 是一种氧化.

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