SiC半桥功率模块的封装过程和动态表征:电热联合设计和实验验证
Kaida Cai1, Jing Xiao1, Xingwei Su1
1School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.
Micromachines
|July 30, 2025
概括
本研究介绍了碳化 (SiC) 功率模块的闭环验证方法,集成设计,模拟和微型制造流程. 经过验证的方法确保了SiC模块在苛刻的应用中可靠的性能.
科学领域:
- 材料科学与工程 材料科学与工程
- 电气工程 电气工程
- 半导体设备物理 半导体设备物理
背景情况:
- 碳化 (SiC) 半桥功率模块是电动汽车和可再生能源系统等高功率应用中的关键组件.
- 在验证电热合模型与SiC模块制造过程可靠性之间存在差距.
- 准确的建模和过程控制对于确保SiC功率模块的长期性能和安全至关重要.
研究的目的:
- 提出和验证一种闭环方法论,用于协作设计,模拟和验证SiC功率模块的过程.
- 为高密度SiC模块的微/纳米制造建立一个关键过程基准.
- 为了弥合电热模拟精度和微型制造工艺可靠性之间的差距.
主要方法:
- 开发了一个"设计模拟过程验证"闭环方法.
- 集成的电热模拟使用LTspice XVII和COMSOL多物理 6.3.3.
- 采用了微型/纳米包装工艺,包括导电粘合剂烧结和线粘合.
- 使用多功能双脉冲测试板进行动态表征和实验验证.
主要成果:
- 与模拟相比,包装的SiC模块成功通过了800V高压验证,排水电流的误差为<0.65%.
- 模拟的结点温度达到80°C,远低于175°C的安全值,实验验证证证了低热应力.
- 显微镜分析证实无空气烧结和粘合接口,表明高质量的微型制造.
- 寄生诱导的特征是准确的 (6nH模拟与8.3nH实验),和热评价显示高峰温度低于175°C在200kHz.
结论:
- 拟议的闭环方法有效地将电热模拟与SiC功率模块微型制造工艺相结合.
- 该研究为高密度SiC模块的可靠微/纳米制造提供了经过验证的工艺基准.
- 这种方法增强了电热模型之间的协作验证和工艺可靠性,这对于先进的功率电子来说至关重要.
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