热塑性聚合物的温度/压力依赖的分量爬行模型
Leixiao Wu1, Wei Cai1, Jie Yang1
1College of Mechanical and Electrical Engineering, Hohai University, Changzhou 213022, China.
Polymers
|July 30, 2025
概括
这项研究引入了热塑性聚合物的分数爬行模型,准确地预测了在各种温度和应力下材料的行为. 新的模型提供了一种更简单,更有效的方法来理解材料降解和预测故障时间.
科学领域:
- 材料科学 材料科学 材料科学
- 聚合物科学 聚合物科学
- 机械工程 机械工程
背景情况:
- 热塑性聚合物爬行受到负载条件的显著影响,需要准确的内在模型.
- 现有的模型往往缺乏捕捉温度/压力依赖的爬行和加速损伤的精度.
- 了解和预测爬行行为对于材料设计和安全至关重要.
研究的目的:
- 为热塑性聚合物开发先进的分数爬行模型.
- 描述温度/压力依赖的爬行,爬行恢复和加速爬行损伤.
- 为了提高预测能力,将模型参数与温度和初始应力相关联.
主要方法:
- 开发包含温度和应力依赖性的分数爬行模型.
- 使用主曲线概念对分数顺序的物理解释.
- 将蒙克曼-格兰特定律与破裂时间预测的分数爬行损害模型集成.
主要成果:
- 提出的分数爬行模型准确地描述了温度/压力依赖的爬行和爬行恢复.
- 建立了一个标准,将模型参数与温度和初始应力联系起来.
- 这些模型成功地预测了与蒙克曼-格兰特定律相结合时的爬行破裂时间.
- 实验验证证了该模型在各种负载条件下的适用性.
结论:
- 分数爬行模型为分析热塑性聚合物行为提供了强大的框架.
- 与现有方法相比,开发的模型提供了优越的简单性和性能.
- 这项研究提高了在运营压力下预测材料性能和故障的能力.
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