相关实验视频

Updated: Sep 13, 2025

Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites

Application of a Coupling Agent to Improve the Dielectric Properties of Polymer-Based Nanocomposites

Published on: September 19, 2020

开发多孔COP-陶复合材料,用于下一代通信系统中作为低相对允许度,低介电损耗的基板

Seisuke Ata¹, Takumi Ono², Yuto Kato³

¹Research Institute for Chemical Process Technology, National Institute of Advanced Industrial Science and Technology, Central 5, 1-1-1, Higashi, Tsukuba, 305-8565, Ibaraki, Japan. ata-s@aist.go.jp.

Scientific reports

|July 31, 2025

概括

新的环烯聚合物复合材料具有可控的孔隙性,为先进的通信系统提供出色的介电性质. 这些低损耗材料非常适合5G和6G应用,确保在更高频率下稳定,低功耗性能.

科学领域:

材料科学材料科学材料科学
电气工程电气工程
聚合物科学聚合物科学

背景情况:

下一代通信系统 (5G,6G) 对于更高的频率,需要具有较低的相对电容性和散射因子的材料.
现有材料在满足高频率稳定,低功耗通信需求方面面临挑战.

研究的目的:

开发和评估基于环烯聚合物 (COP) 的复合材料作为先进通信设备的低通透性,低损耗基材.
研究超临界二氧化碳泡引入的多孔性对COP复合材料的介电和热性能的影响.

主要方法:

基于COP的复合材料是用 (Al2O3) 或化 (AlN) 填充剂制造的.
使用超临界二氧化碳泡来引入受控的孔隙性.
介电性质 (相对电容性和散射因子) 用平衡型圆盘共振器方法测量到120 GHz.
分析了热膨胀和导电性.

主要成果:

穿孔性有效地降低了相对允许度和散射因子,而不会对热性能产生负面影响.
COP-AlN复合材料实现了低于2.0的相对导电率和低于1x10^-3.0的散射系数.
观察到的电容性趋势与有效介质理论 (马克斯韦尔-加内特和布鲁格曼模型) 相一致.
复合材料证明了与铜导体的增强兼容性.

结论:

泡COP-AlN复合材料是下一代通信技术中低允许度,低损耗基板的有希望的候选者.
开发的材料具有良好的介电和热性能,适用于高频应用.
与铜导体的增强兼容性进一步支持它们对先进电子设备的可行性.

关键词:

消散因子 (tan δ) 是一个消散因子.高频介电特性高频介电特性低压电基质的基板多孔的COP复合材料多孔的COP复合材料超临界的二氧化碳泡化

更多相关视频

Fabrication and Characterization of Superconducting Resonators

Fabrication and Characterization of Superconducting Resonators

Published on: May 21, 2016

Multi-material Ceramic-Based Components – Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

Multi-material Ceramic-Based Components – Additive Manufacturing of Black-and-white Zirconia Components by Thermoplastic 3D-Printing (CerAM - T3DP)

Published on: January 7, 2019

相关概念视频

Susceptibility, Permittivity and Dielectric Constant

Susceptibility, Permittivity and Dielectric Constant

When placed in an external electric field, a dielectric material gets polarized. The charge density in the dielectric material is given by the sum of the bound and free charge densities, while the total charge density can also be written in terms of the total electric field. The bound charge density can be measured in terms of polarization, leading to the relationship between electric displacement and polarization.

Capacitor With A Dielectric

Capacitor With A Dielectric

Parallel plate capacitors consist of two conducting plates separated by a certain distance. However, it is mechanically difficult to hold the large plates parallel to each other without actual contact. Hence, a dielectric layer is commonly placed between the plates, which provides an easy solution for holding the plates together with a small gap and increases the capacitance of the capacitor.
Dielectrics are non-conducting materials with no free or loosely bound electrons. When a dielectric is...