通过层接触封装的石墨烯使用一步激光切割.
Sang-Chan Park1, Won Gyun Park1, Chulsoo Kim1
1Department of Electronics Engineering, Chungnam National University, Daejeon 34134, Republic of Korea.
ACS applied materials & interfaces
|August 5, 2025
概括
一种新的一步二氧化碳激光切割方法简化了封装石墨烯的电接触. 这种技术使先进的电子和传感器件的可扩展,低成本的制造成为可能.
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