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在SOI平台下开发的1×8功率分割器的设计,制造,测试和包装
Applied optics
|August 12, 2025
概括
本研究概述了在绝缘体 (SOI) 平台上的1x8电源分割器的设计和制造. 它详细介绍了光子电路设计,制造,组装和3D打印的包装,用于光学信号集成.
科学领域:
- 光子学和光学工程 光子学和光学工程
- 材料科学与工程 材料科学与工程
- 电气和计算机工程 电气和计算机工程
背景情况:
- 在绝缘体 (SOI) 技术是集成光学的一个关键平台.
- 功率分离器是光通信系统中的基本组件.
- 高效的设计和制造对于设备的性能至关重要.
研究的目的:
- 在SOI平台上设计和制造1x8电源分割器的全面路线图.
- 详细说明光学设备的组装和包装过程.
- 为了展示光纤接口和3D打印组件的集成.
主要方法:
- 使用计算程序 (FDTD,BPM) 的光子电路设计和验证.
- SOI制造技术的描述.
- 组件,光信号合和组件集成的详细解释.
- 使用3D打印开发和制造定制包装.
主要成果:
- 成功设计和验证了1x8功率分离器光子电路.
- 在SOI平台上描述制造过程.
- 开发一个强大的组装程序,用于光学信号集成.
- 创建一个功能性的3D打印包,带有光纤接口.
结论:
- 提出的路线图为实现基于SOI的1x8电源分割器提供了完整的工作流程.
- 整合3D打印包装为设备外和光纤连接提供了一个实用的解决方案.
- 这项工作有助于推动集成光子设备制造和包装的进步.
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