直接晶圆结合的数值和机械分析,考虑到不均的不纯度粒子分布
Feixiang Tang1,2, Siyu He3, Yuhan Li2
1School of Microelectronics, Hefei University of Technology, Hefei, China.
Microsystems & nanoengineering
|August 12, 2025
概括
直接晶圆粘合将半导体晶圆连接到没有粘合剂的半导体晶圆,这对微电子非常重要. 杂质分布显著影响粘合质量,表面杂质对应变能产生最大影响.
科学领域:
- 材料科学 材料科学 材料科学
- 半导体制造业 半导体制造业
- 纳米技术纳米技术
背景情况:
- 直接晶圆粘合是制造集成电路,微电机系统 (MEMS) 和多功能芯片的关键技术.
- 评估晶圆粘合质量至关重要,芯片偏移和应变能量是重要的指标.
- 在结合过程中存在的杂质可以显著降低债券的质量.
研究的目的:
- 调查各种杂质分布对晶圆粘合质量的影响.
- 开发和验证用于分析晶圆结合的数学和有限元模型.
- 为了解杂质如何影响晶圆粘合性能提供理论框架.
主要方法:
- 开发一个用于晶圆粘合的数学模型.
- 创建一个有限元模型来模拟晶圆粘合.
- 分析不同的杂质分布 (集群,复杂,面,直线) 以及它们对应变能量的影响.
主要成果:
- 晶圆曲率,厚度和杂质分布共同影响压力下的拉伸能量.
- 杂质颗粒的表面分布证明对晶圆粘合质量产生了最显著的影响.
- 有限元模拟证实了开发的数学模型的准确性.
结论:
- 杂质的分布是决定直接晶圆粘合质量的关键因素.
- 表面杂质分布对粘合性能产生最重要的影响.
- 经过验证的模型提供了一个理论基础,通过控制杂质效应来优化晶圆粘合过程.
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