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Updated: Jun 30, 2026

Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies
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紧的深槽辅助曲在SiN平台上,用于单体集成激光.

Ziyao Zhang, Ilias Skandalos, Rui Ma

    Optics express
    |August 13, 2025
    PubMed
    概括

    研究人员开发了一种新的化 (SiN) 曲结构,使用深度蚀刻槽. 这一创新大大减少了光子集成电路 (PIC) 的曲半径和损失,使得更紧的设计成为可能.

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