一种基于多变量线性回归的结点温度预测方法,使用SiC MOSFETs当前下降特征
Haihong Qin1, Yang Zhang1, Yu Zeng2
1College of Automation Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 211106, China.
Sensors (Basel, Switzerland)
|August 14, 2025
概括
准确估计碳化物 (SiC) MOSFET连接温度 (Tj) 是至关重要的. 本研究引入了一种使用关闭电流下降时间和下降损失的新方法,用于精确监测功率电子中的Tj.
科学领域:
- 电力电子 电力电子 电力电子
- 半导体设备 半导体设备
- 热管理 热管理
背景情况:
- 连接温度 (Tj) 对化碳 (SiC) MOSFETs至关重要,影响性能和可靠性.
- 使用单个温度敏感电参数 (TSEP) 的传统方法由于温度敏感度有限,难以准确.
- 准确的Tj估计对于电力电子系统的状态监测和可靠性至关重要.
研究的目的:
- 开发一种准确和实用的方法来估计SiC MOSFET连接温度 (Tj).
- 利用互补的TSEP,特别是关机电流下降时间 (t_fi) 和下降损失 (E_fi),以改进Tj预测.
- 为了实现先进的状态监测和智能传感功率电子.
主要方法:
- 证明了使用当前跌落时间和跌落能量损失作为TSEP的可行性.
- 开发了一种使用多变量线性回归 (MLR) 的合交叉点温度预测模型.
- 用人t_fi和E_fi作为Tj估计的MLR模型中的输入变量.
主要成果:
- 实验验证证证实了拟议的MLR方法的高预测准确性.
- 这种方法有效地利用了SiC MOSFETs当前下降阶段的特征.
- 与传统的单一TSEP方法相比,已经证明了其优越性.
结论:
- 提出的基于MLR的方法提供了准确的SiC MOSFET连接温度 (Tj) 估计.
- 该技术增强了电力电子系统的状态监测和可靠性评估.
- 为功率电子中的智能传感应用提供了巨大的潜力.
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