中间层 工程铁电NAND闪电 克服下一代高密度存储系统的可靠性和稳定性瓶
Giuk Kim1, Sangho Lee1, Hyojun Choi1
1Department of Electrical engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon, 34141, South Korea.
Advanced science (Weinheim, Baden-Wurttemberg, Germany)
|August 23, 2025
概括
具有工程门堆的铁电晶体管提高了3D NAND闪存的可靠性和稳定性. 这种进步提高了性能,并为下一代非易失性存储提供了更高的位密度.
科学领域:
- 材料科学
- 电气工程
- 半导体物理
背景情况:
- 铁电晶体管是下一代非挥发性内存的关键,因为它具有多层存储和低压操作.
- 门注射型铁电晶体管为3D NAND闪存提供优势,但由于复杂的偏振切换和电荷捕获相互作用,可靠性受到阻碍.
研究的目的:
- 通过设计门来解决铁电NAND的可靠性和稳定性问题.
- 调节偏振动力学,改善偏振切换和电荷捕获机制的合.
主要方法:
- 在HfZrOx矩阵中使用中间层的门工程.
- 分析建模以了解门堆优化和设备物理.
主要成果:
- 实现了高达11V的内存窗口,工作电压低于18V.
- 经过10年以上的三级细胞保留,干扰免疫,和54%的门电压变化.
- 降低了20%的程序电压, 实现了积极的垂直缩放和25%的更高位密度.
结论:
- 工程门克服了铁电NAND的可靠性和稳定性瓶.
- 铁电NAND是一个可扩展和节能的解决方案,用于先进的非易失性存储器.
- 这项研究为优化未来内存应用的铁电门堆提供了见解.
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