使用高压传输电子显微镜在Sn-3Ag-0.5Cu/Cu合物中实地观察变形
Kazuhiro Nogita1, Xin Fu Tan1, Jiye Zhou1
1Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, The University of Queensland, St. Lucia, QLD 4072, Australia.
Materials (Basel, Switzerland)
|August 28, 2025
概括
了解接关节的故障对于可靠的电子设备至关重要. 这项研究引入了现场高压传输电子显微镜 (HV-TEM) 方法,用于观察Sn-3重%Ag-0.5重%Cu (SAC305) 接接头的微结构变形和故障机制.
科学领域:
- 材料科学
- 金属工程
- 电子可靠性
背景情况:
- 由于在变形过程中实时,原子尺度分析的挑战,接关节的故障机制尚未完全理解.
- 可靠的电子元件取决于对压力下的接关节的彻底理解.
研究的目的:
- 开发一种创新的现场方法来观察微结构对纳米尺度拉伸应变的反应.
- 在Sn-3重%Ag-0.5重%Cu (SAC305) 合金接头中阐明接关节的故障机制.
主要方法:
- 使用高压传输电子显微镜 (HV-TEM) 进行现场观测.
- 在室温下对铜基板之间的SAC305接接头施加拉伸应变.
- 实时记录变形过程中的微结构事件.
主要成果:
- 观察到溶微结构中的脱位形成和移动.
- 记录了谷物边界形成,分离和相关的微观结构演变.
- 在拉力加载过程中识别了裂的启动和传播途径.
结论:
- 在现场开发的HV-TEM技术为接关节故障机制提供了前所未有的洞察力.
- 微观结构事件,如位活动和谷物边界变化,直接导致裂的产生和传播.
- 这项研究有助于进一步了解机械应力下接关节的可靠性.
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