电子产品生产中可靠性改进方法的审查
Zbyněk Plachý1, Anna Pražanová1, Karel Dušek1
1Department of Electrotechnology, Faculty of Electrical Engineering, Czech Technical University in Prague, Technická 1902/2, 166 27 Prague, Czech Republic.
Polymers
|August 28, 2025
概括
聚合物补充封装通过管理热力学应力来提高电子设备的可靠性. 选择正确的方法可以平衡材料性能和制造可加工性,以获得最佳的结果.
科学领域:
- 材料科学
- 机械工程
- 电子包装
背景情况:
- 电子设备的微型化需要先进的包装来提高可靠性.
- 在电子组件中减轻热力学应力时,聚合物补充封装至关重要.
- 需要对性能和可加工性权衡进行系统分析.
研究的目的:
- 提供聚合物填充封装技术的系统分析.
- 为了解决性能-可加工性权衡的各种填充方法.
- 建立一个决策框架,将应用要求与材料科学和工艺限制联系起来.
主要方法:
- 从毛细管流到晶圆水平的下填充技术的系统文献审查.
- 分析和比较不同的填充方法.
- 基于热力学性能与可加工性权衡的不足填充策略.
主要成果:
- 确定了三种不同的策略:最大可靠性 (高度填充,后应用),高生产率 (集成,预应用) 和有针对性的强化 (板层包装的柔性聚合物).
- 最大可靠性策略提供了优良的性能,但制造速度较慢.
- 高生产率策略简化了制造,但限制了聚合物化学和填料含量.
结论:
- 最佳的填充选择取决于应用.
- 决策包括平衡固化材料性能与聚合物系统的加工需求.
- 填充不足的选择需要考虑特定电子组装要求的细微方法.
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