使用多层漂移和场板终结结构的GaN P-i-N二极管的设计和TCAD模拟
Zhibo Yang1, Guanyu Wang1, Yifei Wang2
1School of Integrated Circuits, Chongqing University of Posts and Telecommunications, Chongqing 400065, China.
Micromachines
|August 28, 2025
概括
垂直化 (GaN) P-i-N二极管对电源应用具有前景,但面临故障电压限制. 这项研究优化了边缘终结技术,以提高它们的高压性能和可靠性.
科学领域:
- 材料科学
- 电气工程
- 半导体物理
背景情况:
- 垂直化 (GaN) P-i-N二极管提供卓越的高压性能,快速切换和低导电损失.
- 设备边缘的电场拥挤大大限制了这些二极管的故障电压.
研究的目的:
- 系统地评估垂直GaN P-i-N二极管的各种边缘终结技术.
- 提供一个优化的多层漂移GaN P-i-N二极管与场板终端.
- 为高性能GaN电源设备提供实用设计指南.
主要方法:
- 使用Silvaco TCAD (2019) 工具进行设备模拟和分析.
- 评估了深度雕刻的梅萨,形的梅萨和田边边缘终端配置.
- 在不同温度下分析了前导,反向破坏和切换性能.
主要成果:
- 一个优化的多层漂移GaN P-i-N二极管与场板终端证明了更好的电性能.
- 对电压,电阻,故障电压和电场分布进行了详细的分析.
- 研究了前向和反向恢复特征,包括电压超标,载波动态,峰值电流和恢复时间.
结论:
- 优化边缘终结对于克服垂直GaN P-i-N二极管的故障电压限制至关重要.
- 这种现场板终止策略为提高设备性能提供了可行的途径.
- 这项研究为下一代GaN电源设备的设计和开发提供了宝贵的见解.
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