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Updated: May 2, 2026

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基于LCOS-SLM的集成激光切割系统用于碳酸基板制造中的偏差校正

Heng Wang1, Qiang Cao1,2, Yuting Hou3

  • 1The Institute of Technological Sciences, Wuhan University, Wuhan 430072, China.

Micromachines
|August 28, 2025
PubMed
概括

这项研究引入了一种用于碳化 (SiC) 的新型激光切片系统,该系统可纠正偏差,提高精度并减少损坏. 该系统增强了能量度,以实现高效的SiC基板加工.

关键词:
偏差校正激光功率减弱激光切片碳化空间光调节器

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