半导体过程中的无机酸和氨排放因子
Fu-Yun Chen1, Ming-Peng Yeh1, Sher Ling Lee2
1Environmental Monitoring Center, Green Manufacturing Department, Facility Development Division, Facility, Taiwan Semiconductor Manufacturing Company, Ltd., Taichung 407, Taiwan.
The Science of the total environment
|August 29, 2025
概括
在2020年至2022年期间,研究了各种技术节点的无机酸和氨的半导体制造排放因子. 氨是主要的排放物,随着先进的工艺而增加,而酸性排放通常会减少.
科学领域:
- 环境科学
- 化学工程
- 工业生态
背景情况:
- 半导体制造使用危险化学品,因此需要对污染控制装置的排放进行评估.
- 了解排放因子对于半导体行业的环境合规性和流程优化至关重要.
研究的目的:
- 在2020年至2022年期间,从五个技术节点 (1.2μm到12nm) 的九个半导体设施中量化无机酸和氨的排放因子.
- 分析这些排放因子与制造工艺进步和洗机运行条件的趋势.
主要方法:
- 排放因子是以污染物排放为单位的化学物质使用后的污染控制.
- 这些数据来自代表不同技术节点的九个半导体制造厂.
- 进行了统计分析以确定趋势和相关性.
主要成果:
- 盐酸,硫酸,酸和氨的排放因子分别为0.0017,0.0002,0.0017-0.013和0.002公斤/升.
- 发现酸排放因子,特别是较旧的1.2μm节点,低于以前报告的文献值.
- 随着工艺的进步,发现无机酸排放总体下降趋势,而离子排放则随着洗水中的度增加而增加.
结论:
- 氨是半导体制造的主要排放物种,其比例在更先进的工艺中增加.
- 无机酸的排放因子随着技术进步而降低,这表明这些物质的污染控制效率有所提高.
- 鉴于其在先进半导体制造中日益普及,对控制氨排放的进一步研究是有必要的.
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