高性能模式 (解复合器) 辅助微环共振器在酸在绝缘体平台上
Wenbing Jiang1,2, Jiang Qu1,2,3, Yu Guo1,2
1Wangzhijiang Innovation Center for Laser, Aerospace Laser Technology and System Department, Shanghai Institute of Optics and Fine Mechanics, Chinese Academy of Sciences, Shanghai, 201800, China.
Nanophotonics (Berlin, Germany)
|September 2, 2025
概括
我们开发了一种新型的芯片模式 (de) 复合器, 对于先进的光子应用来说至关重要.
科学领域:
- 光子学和光学工程
- 材料科学 (在绝缘体上的酸)
背景情况:
- 高灭率模式 (de) 复合器对于高容量模式分割复合和芯片上的声光调制器 (AOM) 是必不可少的.
- 现有的芯片模式 (脱) 复合器缺乏在基离子体 (LNOI) 平台上集成的AOM的性能.
研究的目的:
- 在声光调制中提出和演示高灭率信号路由的创新方案.
- 解决LNOI上集成AOM的当前芯片模式 (去) 复合器的局限性.
主要方法:
- 使用两种模式的 (de) 复合器与高Q赛道微环共振器相结合.
- 使用单步电子束光刻和干蚀刻工艺制造的集成设备.
主要成果:
- 两种模式的 (脱) 复杂器实现了低于-20dB的交叉声和在1514-1580nm范围内低于1.92dB的芯片插入损失.
- 微环共振器过器增强了载波信号的抑制,导致测量的灭率超过30dB.
结论:
- 开发的设备提供了一个可行的,紧的解决方案,用于在LNOI上实用的多式联运AOM.
- 这项技术使光子和量子信息处理,微波光子和LiDAR应用的进步成为可能.
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