在单层MoS2晶体管上顶端绝缘体的原子层沉积的前体工程
Alexander B Shearer1, Jung-Soo Ko2, Anh Tuan Hoang2,3
1Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States.
ACS nano
|September 8, 2025
概括
选择正确的原子层沉积 (ALD) 前体是2D半导体如二硫化物 (MoS) 上高质量的门绝缘体的关键. 较长的配体可以改善绝缘体核化,从而提高晶体管的性能.
科学领域:
- 材料科学 材料科学 材料科学
- 纳米技术 纳米技术
- 半导体物理 半导体物理
背景情况:
- 高质量的门绝缘器对于先进的二维 (2D) 半导体晶体管至关重要.
- 原子层沉积 (ALD) 是沉积超薄膜的关键技术.
- 二硫化物 (MoS) 是下一代电子产品的关键二维材料.
研究的目的:
- 研究原子层沉积 (ALD) 前体选择如何影响单层MoS2上的绝缘体核和生长.
- 了解前体化学与MoS2晶体管性能之间的关系.
主要方法:
- 在MoS2上对ALD的各种 (AlOx) 前体进行了调查.
- 分析了基于前体连接体长度的绝缘体核化延迟和生长均性.
- 使用ALD培养的 (AlOx) 种子层和HfO2制造的顶级MoS2晶体管.
主要成果:
- 增加前体配体长度减少了AlOx在MoS2上的核化延迟,这是由于增强的范德瓦尔斯相互作用.
- 在30个ALD循环中使用trioisobutylaluminum (TIBA) 实现了对MoS2的均≤3nmAlOx覆盖.
- 使用TIBA-AlOx/HfO2介电堆,MoS2晶体管表现出极好的性能,可忽略歇斯底里和0.95纳米相当的氧化物厚度.
结论:
- 在2D材料上,ALD前体化学显著影响绝缘体核和生长.
- 使用TIBA-AlOx和HfO2的全ALD过程为高性能MoS2晶体管提供了一条可行的路线.
- 这项工作为优化2D纳米电子的ALD过程提供了关键的见解.
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