使用YOLO11进行PCB电子元件接缺陷检测,通过保留块和部结构改进
Youzhi Xu1, Hao Wu1, Yulong Liu1
1School of Mechanical Engineering, Anhui University of Technology, Ma'anshan 243002, China.
Sensors (Basel, Switzerland)
|September 19, 2025
概括
这项研究增强了YOLO11n模型用于印刷电路板 (PCB) 缺陷检测. 改进的模型在识别表面安装电子元件接缺陷方面取得了更高的准确性.
科学领域:
- 电子制造业 电子制造业 制造业
- 计算机视觉 计算机视觉
- 人工智能的人工智能
背景情况:
- 印刷电路板 (PCB) 组装在电子制造中至关重要.
- 在PCB组装中检测缺陷对于工业质量控制至关重要.
- 现有的目标检测算法 (双阶段和单阶段) 在参数数量,运行时间或准确性方面存在局限性.
研究的目的:
- 为了提高PCB缺陷检测的准确性和效率.
- 解决传统和单阶段目标检测模型的局限性.
- 为了提高性能,创新和修改YOLO11n模型.
主要方法:
- 修改了YOLO11n模型,将保留块 (RetBlock) 整合到C3K2模块中,创建了RetC3K2模块.
- 通过将其与多分支辅助特征金字塔网络 (MAFPN) 融合,增强了部结构.
- 开发了一个多分支的辅助子网络,以改进多级特征融合和梯度信息传输.
主要成果:
- 改进的YOLO11n模型显示检测精度显著提高.
- 与原始模型相比,在mAP50实现了0.023 (2.5%) 的改善,在mAP75实现了0.026 (2.8%) 的改善.
- 拟议的修改有效地解决了原始YOLO11n架构的局限性.
结论:
- 增强的YOLO11n模型为PCB缺陷检测提供了卓越的性能.
- 整合RetBlock和MAFPN显著提高了检测准确性和效率.
- 这种方法为电子组装中的自动化质量控制提供了更有效的解决方案.
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