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Updated: Jan 17, 2026

Probing C84-embedded Si Substrate Using Scanning Probe Microscopy and Molecular Dynamics
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对Al/AlCu金属间化合物的界面机械性能的原子尺度模拟

Feng-Ning Xue1, Zhi-Qiang Hu1, Yong-Chao Wu1

  • 1State Key Laboratory of Explosion Science and Safety Protection, Beijing Institute of Technology, Beijing 100081, China. shao_jianli@bit.edu.cn.

Physical chemistry chemical physics : PCCP
|September 19, 2025
PubMed
概括

这项研究表明,Al/Al2Cu/Al和Al/Al4Cu9/Al复合材料由于在接口上增强的键强度,显示出更好的机械性能. 然而,Al3Cu接口削弱了复合材料,突出了金属间化合物结构的关键作用.

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相关概念视频

Metallic Solids02:37

Metallic Solids

Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
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