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超宽带插即用光子张力芯包装,低于dB的损失
Erik Jung1, Helge Gehring2, Frank Brückerhoff-Plückelmann1
1Heidelberg University, Kirchhoff Institute for Physics, Im Neuenheimer Feld 227, Heidelberg, Germany.
Science advances
|September 26, 2025
概括
我们为可扩展的光学包装开发了一种插电式光纤到光子集成电路 (PIC) 解决方案. 这种方法实现了创纪录的低插入损失,推进了光子计算和量子技术.
科学领域:
- 光电学是指光电子产品.
- 纳米制造的纳米制造
- 光子学是指光子学的使用方法.
背景情况:
- 光子集成电路 (PIC) 对于高带宽的神经形态和量子计算至关重要.
- 对于PIC来说,可扩展和强大的光学包装是一个重大挑战.
- 有效的光纤到芯片合对于保持光学带宽和最小化损失至关重要.
研究的目的:
- 为了介绍一个新的插即用光纤到PIC解决方案.
- 为了证明PIC的高性能,低损耗的光学包装.
- 推进光子包装的可扩展性,以实现电子芯片集成.
主要方法:
- 在芯片上添加制造对齐对应物,使用双光子聚合.
- 开发用于光纤与PIC接口的3D外平面合器.
- 集成的女性多纤维终端推进电缆与芯片上的对齐功能.
主要成果:
- 通过3D外平面合器实现了0.41dB的峰值传输.
- 在1500-1600nm范围内的损失低于0.55dB的宽带性能证明.
- 在被动的飞机外包装中获得了创纪录的0.78 dB总插入损失.
- 成功地连接了17个端口的光子电路,用于以17.6千兆的速度进行不连贯的光子计算.
结论:
- 开发的插即用接口为光子包装提供了高性能,可靠性和多功能性.
- 这种方法克服了芯片级光子应用的光学包装的主要挑战.
- 该解决方案为可扩展的光子设备集成铺平了道路,类似于电子芯片.
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