在IGBT模块中层和电气参数的结构和温度依赖性
Jibing Chen1, Yanfeng Liu1, Bowen Liu1
1School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan 420023, China.
Micromachines
|September 27, 2025
概括
高功率绝缘门双极晶体管 (IGBT) 模块遭受热疲劳,特别是在它们的层. 这项研究揭示了层微结构如何在极端温度下演变,影响IGBT故障机制.
科学领域:
- 材料科学 材料科学 材料科学
- 电气工程 电气工程
- 可靠性工程可靠性工程
背景情况:
- 绝缘门双极晶体管 (IGBT) 的高功率设备在极端条件下工作,导致老化和故障.
- 层是IGBT模块包装中一个关键的,但尚未研究的弱点.
- 了解接层的行为对于提高IGBT可靠性至关重要.
研究的目的:
- 为了研究IGBT模块层的热疲劳特性.
- 在热循环过程中分析接口结构和金属间化合物 (IMC) 的演变.
- 为了澄清IGBT模块由于层降解而导致的故障机制.
主要方法:
- 在IGBT模块 (-40至150°C) 上进行热疲劳温度循环实验,使用快速温度测试室.
- 在层中检查了微观结构演变和IMC生长模式.
- 测量了IGBT静态参数的变化,使用振荡仪和功率装置分析器测量疲劳后的变化.
主要成果:
- 在热疲劳期间观察到层内的微结构演变和IMC增长.
- 与层退化相关的IGBT静态参数的量化变化.
- 鉴定了层热疲劳引发的特定故障机制.
结论:
- 层的热疲劳显著影响到IGBT模块的可靠性.
- 微观结构变化和IMC增长是层退化的关键指标.
- 这项研究为IGBT模块的热设计和可靠性评估提供了必要的数据.
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