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不同质的整合技术推动了联合包装光学的发展

Han Gao¹, Wanyi Yan¹, Dan Zhang¹

¹School of Electronic Science and Engineering, Xiamen University, Xiamen 361005, China.

|September 27, 2025

概括

共包装光学 (CPO) 将光子电路与电子包整合起来,用于高带宽,节能计算. 像相变材料这样的创新解决了热调节的限制,使下一代硬件成为可能.

科学领域:

光电学和光子学的光电子和光子学.
材料科学材料科学材料科学
计算机工程计算机工程

背景情况:

人工智能,数据中心和HPC的增长需要先进的光学互连.
联合包装光学 (CPO) 将光子集成电路 (PIC) 与电子集成电路 (EIC) 包装集成.
现有的CPO技术在性能,集成和能源效率方面面临挑战.

研究的目的:

探索CPO技术的演变和性能.
调查CPO的先进包装技术,包括FOWLP,TSV和TGV.
检查新的波导制造方法和光学合策略.

主要方法:

对风扇外晶圆水平包装 (FOWLP),通过通过 (TSV) 和通过玻璃通过 (TGV) 包装的审查.
对秒激光直接写作和离子交换玻璃波导的分析.
使用相变材料 (PCM) 探索微环共振器 (MRR) 和非挥发性神经形态光子.

主要成果:

微环共振器 (MRR) 提供高密度,高能效的解决方案,但面临热调节的局限性.
换相材料 (PCM) 能够实现非挥发性神经形光学,克服热交叉声和静电问题.
光子记忆和CPO的深度集成有望带来协同效益.

结论:

为了满足AI和HPC的需求,CPO技术至关重要.
包装,波导和材料的进步正在推动CPO性能.
将CPO与神经形态光子学结合在一起,是开发下一代高效率计算硬件的关键.

关键词:

高铁高铁 (TGV) 是一个高铁.在TSVV中,人工神经形态的人工神经形态.联合包装的光学产品风扇外送晶圆水平包装晶圆水平包装五秒激光直接写波导的波导.不同质的整合.离子交换器玻璃波导.的光学互连连接.

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